1. 2. 3. material content data sheet sales product name tle6230gp issued 28. august 2013 ma# MA000710008 package pg-dso-36-48 weight* 2043.97 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 11.906 0.58 0.58 5825 5825 leadframe inorganic material phosphorus 7723-14-0 0.383 0.02 187 non noble metal zinc 7440-66-6 1.533 0.08 750 non noble metal iron 7439-89-6 30.652 1.50 14996 non noble metal copper 7440-50-8 1244.598 60.89 62.49 608912 624845 wire non noble metal copper 7440-50-8 2.422 0.12 0.12 1185 1185 encapsulation organic material carbon black 1333-86-4 1.451 0.07 710 plastics epoxy resin - 66.731 3.26 32648 inorganic material silicondioxide 60676-86-0 657.160 32.15 35.48 321512 354870 leadfinish non noble metal tin 7440-31-5 16.150 0.79 0.79 7901 7901 plating noble metal silver 7440-22-4 0.741 0.04 0.04 362 362 solder noble metal silver 7440-22-4 0.154 0.01 75 non noble metal tin 7440-31-5 0.102 0.00 50 non noble metal lead 7439-92-1 9.988 0.49 0.50 4887 5012 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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